AMERI Rates
| CURRENT RATES | ||
| Rate (name) | Unit Base | Internal |
| SAMPLE PREP ROOM ACCESS | each | $ 8 |
| CLEANROOM ACCESS | each | $ 19 |
| Jar Mill Roller | hr | $ 2 |
| Sample Prep Ultrasonicator | hr | $ 2 |
| Fluid Bath Hot Plate | hr | $ 11 |
| JIB4500 SEM | hr | $ 18 |
| Training | hr | $ 22 |
| Engineering Service | hr | $ 9 |
| Tool Operation/Gen.Labor-AMERI Staff Operator | hr | $ 35 |
| Allwin21 Asher | hr | $ 3 |
| Allwin21 RTP | hr | $ 2 |
| Vacuum Oven | hr | $ 6 |
| Cleanroom Furnace | hr | $ 27 |
| Dicing Saw | hr | $ 22 |
| Ebeam Lithography | hr | $ 42 |
| Cleanroom Ultra Sonicator | hr | $ 5 |
| Electropolisher | hr | $ 11 |
| JIB4500 FIB/EDS | hr | $ 59 |
| High Speed Saw | hr | $ 25 |
| Hot Plate | hr | $ 10 |
| Microscopy Ultra Sonicator | hr | $ 6 |
| KJLC PVD Evaporator | hr | $ 1 |
| LiteSizer 500 Dynamic Light Scattering | hr | $ 52 |
| Litho Optical microscope | hr | $ 16 |
| MARCH RIE (1hr.min) | hr | $ 17 |
| Medium Speed Saw | hr | $ 21 |
| Metallograph Microscope | hr | $ 6 |
| Nova 600 Gas Sorption Analyzer | sample | $ 59 |
| OAI (800) Mask Aligner | hr | $ 1 |
| JIB4500 Omniprobe | hr | $ 44 |
| Optical Profiler | hr | $ 29 |
| Parylene Coater | run | $ 13 |
| PlasmaEtch RIE (1hr.min) | hr | $ 5 |
| Polishing Wheel | hr | $ 8 |
| PVD Sputtering | hr | $ 62 |
| Sample Coater Au | run | $ 16 |
| Sample Coater C | run | $ 16 |
| SDT | hr | $ 24 |
| SEM 7000 | hr | $ 31 |
| SEM F100 | hr | $ 30 |
| Shimadzu IRTracer-100 | hr | $ 53 |
| Spincoater Bench | hr | $ 24 |
| STS ICP DRIE | hr | $ 64 |
| TEM | hr | $ 35 |
| uHardness Tester | hr | $ 44 |
| XRD SIEMENS | hr | $ 34 |
| XRD Database | hr | $ 5 |
| XRD Bruker | hr | $ 37 |
| Dektak Profilomater | hr | $ 41 |
| Themal Evaporator | hr | $ 20 |
| Direct Write Lithography | hr | $ 37 |
Please contact the Recharge Center for external rates.
| CURRENT RATES | FUTURE RATES- TO BE ADVISED | ||||
| Rate (name) | Unit Base | Internal | Rate (name) | Unit Base | Internal |
| SAMPLE PREP ROOM ACCESS |
hr
|
4 | |||
| CLEANROOM ACCESS | hr |
5
|
|||
| THERMAL PROCESSES | hr |
6
|
|||
| LOW RESOLUTION SEM | hr |
13
|
|||
| SEM | hr |
45
|
|||
| EDS | hr |
10
|
|||
| TEM | hr |
58
|
|||
| XRD | hr | 32 | |||
| SDT | hr | 21 | |||
| FIB | hr | 53 | |||
| Ebeam Lithography | hr | 54 | |||
| Photolithography [1 hr. min] | hr | 15 | |||
| Laser Lithography UPG101 | hr | 16 | |||
| Parylene Coating | hr | 13 | |||
| RIE [1 hr. min] | hr | 15 | |||
| Ashing | hr | 11 | |||
| PVD; Sputtering [base metals] | hr | 22 | |||
| PVD; Evaporation [base metals] | hr | 20 | |||
| RTA [1 hr. min] | hr | 10 | |||
| Sample coating [Au] | per cycle(3 min cycle) | 13 | |||
| Sample coating [C] | per cycle(3 min cycle) | 14 | |||
| PlasmaTherm RIE [1 hr min] | hr | 15 | |||
| Training | hr | 16 | |||
| Engineering Services | hr | 50 | |||
| Analytical Services | hr | 52 | |||
| Tool Operation/Gen. Labor | hr | 41 | |||
| uHardness tester | hr | 39 | |||
| Omniprobe | hr | 39 | |||
| PlasmaEtch RIE [1 hr min] |
hr | 16 | |||
| 3D printing | hr | 15 | |||
| Dicing saw | hr | 20 | |||
| STS DRIE | hr | 41 | |||
Please contact the Recharge Center for external rates.
