CURRENT RATES			FUTURE RATES- TO BE ADVISED
Rate (name)	Unit Base	Internal	Rate (name)	Unit Base	Internal
SAMPLE PREP ROOM ACCESS	hr	4
CLEANROOM ACCESS	hr	5
THERMAL PROCESSES	hr	6
LOW RESOLUTION SEM	hr	13
SEM	hr	45
EDS	hr	10
TEM	hr	58
XRD	hr	32
SDT	hr	21
FIB	hr	53
Ebeam Lithography	hr	54
Photolithography  [1 hr. min]	hr	15
Laser Lithography UPG101	hr	16
Parylene Coating	hr	13
RIE   [1 hr. min]	hr	15
Ashing	hr	11
PVD; Sputtering [base metals]	hr	22
PVD; Evaporation [base metals]	hr	20
RTA  [1 hr. min]	hr	10
Sample coating [Au]	per cycle(3 min cycle)	13
Sample coating [C]	per cycle(3 min cycle)	14
PlasmaTherm RIE [1 hr min]	hr	15
Training	hr	16
Engineering Services	hr	50
Analytical Services	hr	52
Tool Operation/Gen. Labor	hr	41
uHardness tester	hr	39
Omniprobe	hr	39
PlasmaEtch RIE [1 hr min]	hr	16
3D printing	hr	15
Dicing saw	hr	20
STS DRIE	hr	41

Please contact the Recharge Center for external rates.