AMERI Rates
CURRENT RATES | ||
Rate (name) | Unit Base | Internal |
SAMPLE PREP ROOM ACCESS | each | $ 8 |
CLEANROOM ACCESS | each | $ 19 |
Jar Mill Roller | hr | $ 2 |
Sample Prep Ultrasonicator | hr | $ 2 |
Fluid Bath Hot Plate | hr | $ 11 |
JIB4500 SEM | hr | $ 18 |
Training | hr | $ 22 |
Engineering Service | hr | $ 9 |
Tool Operation/Gen.Labor-AMERI Staff Operator | hr | $ 35 |
Allwin21 Asher | hr | $ 3 |
Allwin21 RTP | hr | $ 2 |
Vacuum Oven | hr | $ 6 |
Cleanroom Furnace | hr | $ 27 |
Dicing Saw | hr | $ 22 |
Ebeam Lithography | hr | $ 42 |
Cleanroom Ultra Sonicator | hr | $ 5 |
Electropolisher | hr | $ 11 |
JIB4500 FIB/EDS | hr | $ 59 |
High Speed Saw | hr | $ 25 |
Hot Plate | hr | $ 10 |
Microscopy Ultra Sonicator | hr | $ 6 |
KJLC PVD Evaporator | hr | $ 1 |
LiteSizer 500 Dynamic Light Scattering | hr | $ 52 |
Litho Optical microscope | hr | $ 16 |
MARCH RIE (1hr.min) | hr | $ 17 |
Medium Speed Saw | hr | $ 21 |
Metallograph Microscope | hr | $ 6 |
Nova 600 Gas Sorption Analyzer | hr | $ 59 |
OAI (800) Mask Aligner | hr | $ 1 |
JIB4500 Omniprobe | hr | $ 44 |
Optical Profiler | hr | $ 29 |
Parylene Coater | run | $ 13 |
PlasmaEtch RIE (1hr.min) | hr | $ 5 |
Polishing Wheel | hr | $ 8 |
PVD Sputtering | hr | $ 62 |
Sample Coater Au | run | $ 16 |
Sample Coater C | run | $ 16 |
SDT | hr | $ 24 |
SEM 7000 | hr | $ 31 |
SEM F100 | hr | $ 30 |
Shimadzu IRTracer-100 | hr | $ 53 |
Spincoater Bench | hr | $ 24 |
STS ICP DRIE | hr | $ 64 |
TEM | hr | $ 35 |
uHardness Tester | hr | $ 44 |
XRD SIEMENS | hr | $ 34 |
XRD Database | hr | $ 5 |
XRD Bruker | hr | $ 37 |
Dektak Profilomater | hr | $ 41 |
Themal Evaporator | hr | $ 20 |
Direct Write Lithography | hr | $ 37 |
Please contact the Recharge Center for external rates.
CURRENT RATES | FUTURE RATES- TO BE ADVISED | ||||
Rate (name) | Unit Base | Internal | Rate (name) | Unit Base | Internal |
SAMPLE PREP ROOM ACCESS |
hr
|
4 | |||
CLEANROOM ACCESS | hr |
5
|
|||
THERMAL PROCESSES | hr |
6
|
|||
LOW RESOLUTION SEM | hr |
13
|
|||
SEM | hr |
45
|
|||
EDS | hr |
10
|
|||
TEM | hr |
58
|
|||
XRD | hr | 32 | |||
SDT | hr | 21 | |||
FIB | hr | 53 | |||
Ebeam Lithography | hr | 54 | |||
Photolithography [1 hr. min] | hr | 15 | |||
Laser Lithography UPG101 | hr | 16 | |||
Parylene Coating | hr | 13 | |||
RIE [1 hr. min] | hr | 15 | |||
Ashing | hr | 11 | |||
PVD; Sputtering [base metals] | hr | 22 | |||
PVD; Evaporation [base metals] | hr | 20 | |||
RTA [1 hr. min] | hr | 10 | |||
Sample coating [Au] | per cycle(3 min cycle) | 13 | |||
Sample coating [C] | per cycle(3 min cycle) | 14 | |||
PlasmaTherm RIE [1 hr min] | hr | 15 | |||
Training | hr | 16 | |||
Engineering Services | hr | 50 | |||
Analytical Services | hr | 52 | |||
Tool Operation/Gen. Labor | hr | 41 | |||
uHardness tester | hr | 39 | |||
Omniprobe | hr | 39 | |||
PlasmaEtch RIE [1 hr min] |
hr | 16 | |||
3D printing | hr | 15 | |||
Dicing saw | hr | 20 | |||
STS DRIE | hr | 41 |
Please contact the Recharge Center for external rates.